4L LCB Bonding PCB Board

Basic Information:
Layer: 4L
Base Material: FR4
Board thickness: 1.6mm
Copper weight: 1Oz
Surface finish: Lead free HASL
Application: Telecommunication
Certificate: UL, ISO9001, TS16949, RoHS

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Product Description

Product Description 4L LCB Bonding PCB Board
Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. If properly designed, wire bonding can be used at frequencies above 100 GHz.

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